eMASCO

Integrated Circuit (IC) Package Assembly Process Engineer is responsible for developing, optimising, and managing the end-to-end packaging and assembly processes for integrated circuits, ensuring functional, reliable, and cost-effective semiconductor products. The engineer designs and evaluates substrates, conducts thermal and mechanical analyses, and collaborates with R&D, quality assurance, and manufacturing teams to support high-volume production. The role also includes design research, process improvement, and providing technical guidance on materials, products, and electronic engineering processes.

Tasks

Design, simulate, and validate IC packaging structures to ensure performance, reliability, and manufacturability.

Develop and review circuit schematics and component selections to support IC packaging and assembly requirements.

Perform board bring-up, testing, and debugging of electronic systems using precision instruments and simulation tools.

Collaborate with cross-functional teams to ensure system integration, thermal and mechanical robustness, and compliance with design rules.

Optimise IC packaging and assembly processes using statistical analysis and root cause investigation to improve efficiency, cost, and quality.

Ensure compliance with relevant standards, regulations, and safety requirements in IC packaging design and manufacturing.

Manage technical documentation, bills of materials (BOMs), testing procedures, audits, and production support activities.

Skills

Basic

Analytical and critical thinking skills to troubleshoot issues and adapt in a fast-paced, technology-driven environment.

Attention to detail, organisational skills, and time management to ensure accuracy and meet project deadlines.

Effective written and verbal communication skills for collaboration with multidisciplinary teams and technical documentation.

Proficiency in relevant design and engineering software, including PCB and EDA tools, for accurate development and verification.

Strong knowledge of electronic and electrical circuit theory for design, analysis, and problem-solving.

Specific

Competency in power electronics design and simulation, including switch-mode power supplies and reliability analysis techniques.

Competency in statistical process control (SPC), failure mode and effects analysis (FMEA), and design for manufacturing (DFM) in semiconductor assembly processes.

Knowledge in IC packaging technologies and related materials science principles.

Knowledge in signal integrity, impedance matching, and low-power design techniques for electronic systems.

Knowledge in workplace safety, health standards, and cleanroom protocols in semiconductor engineering environments.

Proficiency in analogue behavioural modelling and circuit simulation using tools.

Proficiency in electronic design automation (EDA) tools and simulation software for IC, substrate, and package layout design and analysis.

Proficiency in embedded systems development and hardware testing using communication protocols and diagnostic instruments.

Proficiency in high-speed digital and analogue circuit design, including components and phase-locked loops (PLL).

Additional Info

QUALIFICATION

Bachelor’s degree or equivalent

Related Courses

Claimable Course

e-Latih Online Course

Minor Unit Group

Integrated Circuit (IC) Package Assembly Process Engineer

2152-03

Electrotechnical Officer (ETO)

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