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Major Group

Managers

Sub-Major Group

Information and Communications Technology Managers

Minor Group

151

Information and Communications Technology Managers

Unit Group

1511

Information and Communications Technology Managers

Minor Unit Group

MASCO Code

1511-16

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Failure Analysis Section Head (System)

TVET

TVET scope is based on recognized occupational standards, with emphasis on practical components, psychomotor skills and exposure to training in the industry

The Failure Analysis Section Head (System) leads system-level investigations to determine the root causes of failures in electronic and semiconductor products, with overall responsibility for the planning, oversight and quality of failure analysis activities. The role involves managing specialist teams, coordinating with relevant technical and quality functions, and ensuring findings are translated into effective corrective and preventive actions to improve product reliability. It also encompasses oversight of customer return analyses, adherence to applicable quality standards, and contribution to continuous improvement initiatives within the organisation.

Tasks

Manage and oversee physical customer returns, including validation of failure analysis outcomes.

Coordinate and document Eight Disciplines (8D) reports and corrective actions.

Lead failure analysis investigations using Scanning Electron Microscopy (SEM), Energy Dispersive X-ray (EDX), X-ray, and decapsulation techniques.

Perform audits to ensure the effectiveness of corrective measures.

Identify root causes of failures and drive improvements to production flow.

Oversee troubleshooting activities from system-level to component-level.

Oversee the application of Failure Mode and Effects Analysis (FMEA), Control Plans, and Statistical Process Control (SPC) for quality planning.

Collaborate with design, firmware, process, product, test, and reliability engineering teams to resolve issues.

Manage failure analysis laboratory operations and equipment.

Drive quality improvement initiatives through cross-functional teamwork.

J
Information and Communication

Skills

Basic

Ability to work collaboratively across functions for integrated problem-solving.

Critical thinking and decision-making for root cause analysis and corrective actions.

Effective communication and leadership skills to guide teams and coordinate across departments.

Proficiency in quality management tools and methodologies such as 8D and FMEA.

Strong analytical and problem-solving skills to identify and resolve system failures.

Specific

Knowledge in advanced failure analysis techniques such as Scanning Electron Microscopy (SEM), Energy Dispersive X-ray (EDX), and Confocal Scanning Acoustic Microscopy (CSAM).

Knowledge in failure data management, including data structuring, migration, and organisation.

Knowledge in Failure Mode and Effects Analysis (FMEA) for risk assessment and failure prevention.

Knowledge of memory product technologies and testing methodologies.

Knowledge of semiconductor and Surface Mount Technology (SMT) assembly processes.

Proficiency in database management for failure analysis records.

Proficiency in laboratory information systems and data management tools for failure analysis.

Proficiency in statistical analysis and quality improvement tools, including Statistical Process Control (SPC) and Six Sigma methodologies.

Additional Info

QUALIFICATION

Bachelor’s degree or equivalent

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